3M adhesive tape 5413

Details

• The polyimide adhesive tape can be easily removed from the surface as it does not soften at higher temperatures and retains its shape. This means that no post-processing, such as the removal of adhesive residue, is required.
• This adhesive tape can protect surfaces from the effects of chemicals and UV radiation. It is also flame-retardant.
• Polyethylene core instead of cardboard
• The high temperature resistance of the silicone adhesive reduces adhesive leakage, eliminating the need for cleaning.

3M™ 5413 High-Temperature Polyimide Adhesive Tape consists of a polyimide film with silicone adhesive. This brown adhesive tape is 68.58 µm thick and can be used to mask printed circuit boards during the soldering process and for other low- and high-temperature applications, between -73 °C and 260 °C.

The 3M™ High-Temperature Polyimide Adhesive Tape 5413 is designed for masking printed circuit boards during the soldering process and for other low- and high-temperature applications, between -73 °C and 260 °C. This brown, 68.58 µm thick adhesive tape consists of a polyimide film with a silicone adhesive. Furthermore, the roll core is made of polyethylene rather than cardboard. The high temperature resistance of the silicone adhesive reduces adhesive leakage, eliminating the need for cleaning and thereby increasing productivity. The polyimide adhesive tape peels away from the surface with ease, as it does not soften at higher temperatures and retains its shape.